"2D systems alone do not provide sufficient data to determine solder paste volume. For process validation, 3D measurement is recommended."
The primary objective of IPC-7801 is to establish a for a reflow oven and perform periodic verifications to ensure that performance has not drifted. ipc7801 pdf
Using IPC-7801 ensures your process control meets global electronics manufacturing expectations, which is often required for high-reliability sectors like aerospace or medical devices. Calibration & Maintenance: The IPC7801 PDF: A Comprehensive Guide to Understanding