The is a high-precision, multi-chip die bonder manufactured by BE Semiconductor Industries (Besi) . It is widely recognized as a benchmark platform for Multi-Module Attach (MMA) applications, offering exceptional flexibility for both die attach and flip-chip processes.
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: The most reliable source for technical manuals and documentation is the Besi Customer Area Datacon 2200 EVO The is a high-precision, multi-chip
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